| 摘要 |
PURPOSE:To improve the yield by preventing cracks and flaws from being produced upon processing by disposing a thickness adjustment coated film in the vicinity of a position of disposing a slit and a zig-zag blanking hole, and adjusting a thickness between substrates divided by the blanking hole, and adjusting a thickness between substrates divided by the blanking hole and thereafter processing the blanking hole. CONSTITUTION:A thickness adjustment coated film 9 is exposed in the vicinity of a position of disposing a slit 5 and a zig-zag shaped blanking hole 6 between a substrate body 3 on which a printed wiring circuit 2 is formed and divided substrate 4 divided and separated from said substrate body 3. Based upon the thickness of the thickness adjustment coated film 9, adjustment is done by approximating the thickness of a divided substrate 4 side not including the printed wiring circuit 2 to that of the substrate body 2. Thereafter, a printed wiring board 1 is held and set between upper and lower metal molds 7 and 8 for pressing, and thereafter the slit 5 and the zig-zag shaped blanking hole 6 are processed. |
