发明名称 PACKAGING FOR HYBRID CIRCUITS
摘要 A frame for hybrid circuit comprises a floor surrounded on each face by a respective upstanding rim and in which the floor provides a ground plane for circuits mountable upon each face of the floor. The rims include sockets to receive R.F. connectors for supplying R.F. signals into and out of the circuits, the rims further including connection means by which digital and/or D.C. signals can be interconnected with the circuits.
申请公布号 WO9203031(A1) 申请公布日期 1992.02.20
申请号 WO1991GB01341 申请日期 1991.08.05
申请人 GEC-MARCONI LIMITED 发明人 HAYLES, ANTHONY, RALPH
分类号 H01L25/16;H05K5/00 主分类号 H01L25/16
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