发明名称 |
ELECTRIC STRUCTURE AND FORMATION METHOD FOR IT |
摘要 |
PROBLEM TO BE SOLVED: To allow easy re-working by jointing a second conductor to an uncoated surface of a first conductor mechanically and electrically, and jointing the second conductor to a second substrate mechanically and electrically. SOLUTION: Two pads 16 are provided on a surface 13 of a first substrate 12, and a first conductor 14 is formed on each of the pads 16. The first conductor 14 and an upper surface 13 are washed and roughened in a plasma processing, and the first conductor 14 and the upper surface 13 are coated with a material 18 such as photo-sensitized resin. The material 18 is irradiated with the light of appropriate wavelength using a photo-mask to form an uncoated surface 26. A second conductor 52 is mechanically and electrically connected to the surface 26 while the second conductor 52 is mechanically and electrically connected to a second substrate 42 through a pad 46, for easy re-working. |
申请公布号 |
JP2000357853(A) |
申请公布日期 |
2000.12.26 |
申请号 |
JP20000131843 |
申请日期 |
2000.04.28 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
MIGERU ANGERU HIMARESU;CYNTHIA SUSAN MILKOVICH;MARK VINCENT PEARSON |
分类号 |
H01R12/04;B23K1/00;H01L21/48;H01L21/60;H01L23/485;H01L23/498;H01R4/02;H05K1/14;H05K3/00;H05K3/28;H05K3/34;H05K3/36 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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