发明名称 ADHESIVE TAPE BONDING DEVICE AND BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To accurately bond an adhesive tape on a film at high speed without curling it. SOLUTION: This adhesive tape bonding device is provided with a cutter part forming a slit 13 in the film f, an adhesive tape conveyance means for feeding the adhesive tape t up to a position where it is overlapped on the slit on a lower face of the film, a first fusion means for fusing the adhesive tape on the film in a first fusion part 14 surrounding the slit by opening a clearance between the slit and it, and a second fusion means for fusing the adhesive tape in a second fusion part 15 surrounding a part between the first fusion part and the slit. The adhesive tape conveyance means is provided with a suction belt having a small hole and a suction means provided with a plurality of suction chambers separating from each other and a communicating channel communicating adjacent suction chambers. The adhesive tape t is sucked and held on the suction belt and is conveyed. The first fusion means has a trimming heater provided with a heater part nipping the film and the adhesive tape between the suction belt and it. The second fusion means nips the film and the adhesive tape by a fixed heater and a movable heater to bond them. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004359435(A) 申请公布日期 2004.12.24
申请号 JP20030162187 申请日期 2003.06.06
申请人 TOKYO AUTOM MACH WORKS LTD 发明人 SAKAMOTO AKIRA;TAMURA YUTAKA
分类号 B65H35/07;(IPC1-7):B65H35/07 主分类号 B65H35/07
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