| 摘要 |
PURPOSE:To obtain a substrate for electronic-component mounting use by means of a simple constitution by a method wherein at least one connecting pattern whose outer circumference is larger than that of an electronic component and which is connected electrically to a bonding pad is formed inside a die bonding area and the electronic component is mounted on the connecting pattern. CONSTITUTION:A die bonding area 11 is formed on a base material 10 constituting a substrate 100A for electronic-component mounting use; and many bonding pads 20 are arranged so as to surround the die bonding area 11. A large connecting pattern 22 which is connected electrically to two bonding pads 20 is formed on the die bonding area 11. Consequently, after a solder resist 24 is formed on the connecting pattern 22 inside the die bonding area 11 as required, an electronic component 30 is mounted on it by using a die bonding paste 31 or the like. As a result, outer connecting terminals of the mounted electronic component 30 are connected electrically to the individual bonding pads 20 by using bonding wires 40.
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