| 摘要 |
A positive-type photosensitive electrodeposition coating composition comprising (A) a photosensitive compound having a molecular weight of not more than 6,000 and containing at least one modified quinonediazidesulfone units represented by the following formula (I) (I) wherein R1 represents or R2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, R3 represents an alkylene group, a cycloalkylene group or an alkylene ether group, and A represents a carboxylic acid ester linkage, in a molecule and; or a photosensitive compound obtained by reacting a polyfunctional amino compound with obenzoquinonediazidesulfonic acid chloride or onaphthoquinonediazidesulfonic acid chloride, and (B) a water-soluble or water-dispersible resin having a saltforming group. Said composition is suitable for forming a printed wiring photoresist by coating an electrically conductive material-clad laminated plate by electrodeposition to form a smooth film whose portion exposed to actinic rays such as ultraviolet light through a positive photomask can be washed away with a developing solution.
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