| 摘要 |
PURPOSE:To increase the durability of resin, and reduce the external dimension of a heat dissipating plate, as compared with the structure wherein the plate is separately installed, by integrally proving a heat dissipating part wherein leads stretch toward an IC chip in a resin part, and dissipate the heat of the IC chip in the noncontact state. CONSTITUTION:Each lead 2 connected with each bonding pad 6 of an IC chip 1 stretches as far as the lower surface of an IC chip mounting part 5 on which the IC chip 1 is mounted, and forms a heat dissipating part 2a in a unified body which part 2a is arranged so as to be adjacent to and in parallel with the lower surface of the mounting part 5. On the base part side of the heat dissipating part 2a, each of the leads 2 is electrically connected with a bonding pad 6 of the IC pad 1 via a bonding wire 4, and the heat dissipating part 2a is built in a resin part 3 so as to keep the noncontact state with the IC chip 1. The other end of each lead 2 is led out from the resin part 3 outwardly. Hence the heat radiated by the IC chip 1 is received by the heat dissipating part 2a of the lead 2, and dissipated outside the resin part 3 through the lead 2 of high thermal conductivity. |
