| 摘要 |
PURPOSE:To reduce the size and increase the density of a circuit board made by printing thick film method by forming an upper layer circuit in such a manner that resistors provided in a lower layer circuit are not affected by the upper layer circuit. CONSTITUTION:A lower conductor paste 102 as a lower layer circuit and an upper conductor paste 104 which strides over the lower conductor paste 102 via a dielectric paste 103 are formed on a board 101 by repeating printing and baking (hardening). Except part of the formed lower layer circuit to which solder is applied and part which participates in a junction with an upper layer circuit, an insulating layer 107 for insulating from the lower layer circuit is formed on part of which the upper layer circuit is applied by using the dielectric paste capable of being baked (hardened) at such a low temperature as not affecting the adjusted resistor 105 of the lower layer circuit. The upper layer circuit is formed on the insulating layer 107 by repeating the printing an baking (hardening) by using a conductor paste 108 also capable of a low temperature baking (hardening), a resistor paste 109 and the like. |
