| 发明名称 |
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| 摘要 |
<p>A tape for use in tape-automated-bonding of integrated circuits is disclosed. A series of interconnection arrays ("frames") are arranged along the tape, each array being formed by a number of interconnection beams 3. A terminal ("bump") 6 is located on each beam 3 for bonding to a respective interconnection pad 7 of an integrated circuit 8. Conventional bumps are made of gold-plated copper and have uneven and unyielding bonding surfaces which can fail to provide consistent bonds. The bumps 6 of the tape disclosed comprise a conductive material having a Vickers hardness number of 55 or less, and thus have a compliance which facilitates more even bonding. A method of producing the tape is also disclosed.</p> |
| 申请公布号 |
JPH0371778(B2) |
申请公布日期 |
1991.11.14 |
| 申请号 |
JP19900148461 |
申请日期 |
1990.06.05 |
| 申请人 |
BURITEITSUSHU TEREKOMYUNIKEESHONZU PLC |
发明人 |
FURANSHISU NIHAARU SHINADORAI;DABITSUDO JON SUMOORU;AREKUSANDA ANSONII BUREIN;KENISU KUUPAA |
| 分类号 |
H01L21/48;H01L21/60;H01L23/495;H05K3/40 |
主分类号 |
H01L21/48 |
| 代理机构 |
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