| 摘要 |
PURPOSE:To mount an electronic component on a board with high accuracy by a method wherein a hole for position recognition use is made in a part near a part where the electronic component is to be mounted in a ceramic green sheet and, after that, a conductor layer is formed. CONSTITUTION:A part 2 on which an electronic component is to be mounted and on which a bare chip 5 is mounted is formed of a conductor on a green sheet of a board 1 composed of an insulating ceramics or the like; holes 3, 3 for position recognition use are made near it by referring to the reference face of the board 1, e.g. its edge or its cut wire. Then, the green sheet is baked. When the bare chip 5 is mounted, the holes 3, 3 for position recognition use are pattern-recognized. The bare chip 5 is mounted by referring to them and is wire-bonded. Thereby, the electronic component can be mounted on the board with high accuracy.
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