发明名称 PRODUCTION OF EPOXY RESIN MOLDING
摘要 PURPOSE:To provide fluidity to a semi-cured product before curing and to prevent a molding from producing crack and peeling by semi-curing a composition contg. an epoxy resin and a curing agent, bringing two or more semi-cured products into contact with each other or a semi-cured product into contact with an uncured compsn. contg. an epoxy resin with a different compsn. from this and a curing agent and curing them by heating. CONSTITUTION:Semi-cured products each with a specified shape and formed by combining an epoxy resin with a curing agent are brought into contact with each other, or one or two or more semi-cured products each with a specified shape are placed in a proper interrelated position and uncured resin compsn. each with different kind and/or loading of an additive are cast between them and are heated. It is pref. that the heating temp. is 60-180 deg.C, preferably 100-150 deg.C. In addition, even though heating can be performed just after casting, it is pref. that after casting, it is kept at room temp. and is then heated after being semi-cured. The semi-cured product is softened by heating and is turned to a viscous product with a fluidity and the semi-cured product and the uncured product are curd together to obtain a resin molded item wherein the interface is clear and there is no possibility to produce peeling in the interface and both are integrally bound together.
申请公布号 JPH03244513(A) 申请公布日期 1991.10.31
申请号 JP19900041199 申请日期 1990.02.23
申请人 KOKUSAI CHEM KK 发明人 KOMATSUMOTO TSUTOMU
分类号 B29C35/02;B29C39/10;B29C39/12;B29K63/00;C08G59/18 主分类号 B29C35/02
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