Infrared heater array for IC soldering

摘要

An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is convergingly reflected by the associated lamp envelopes to pass through the radiation slits toward the rotational axis of the X and Y pairs of reflecting members. The X and Y pairs of reflecting members are rotationally oriented to reflect IR radiation onto the bonding sites to effect bonding of the FPD to the circuit board.