发明名称 LIQUID TRANSFER MOLDING
摘要 PURPOSE:To necessitate no pot and to enable high speed transfer molding by a method wherein a thermosetting liquid resin material flowing at 100 deg.C or less poured directly in two or more metal molds from two or more parts of the side thereof. CONSTITUTION:When a pouring port 4 is separated from the metal mold 1, a valve 7 is made to advance by an air cylinder 9, and is adhered closely to a valve seat 5 to prevent sending out of resin 11. The heated upper mold 2A, lower mold 2B are tightened up. Compressed air is introduced in a vessel 10, the metal mold 1 and the pouring port 4 are adhered closely, the valve bar 7 is made to retreat, and resin 11 is sent with pressure to the metal mold 1. After pressure is applied till resin 11 filled up in respective cavities 3 is hardened, the valve 7 is made to retreat adhering the valve 7 closely to the valve seat 5 to separate the pouring port 4 from the metal mold 1, and the upper and the lower molds are separated to take out moldings. By this constitution, because no pot is used, yield of material is enhanced remarkably, and moreover, automatic and continuous high speed molding is enabled.
申请公布号 JPS5775435(A) 申请公布日期 1982.05.12
申请号 JP19800152465 申请日期 1980.10.29
申请人 MITSUBISHI DENKI KK 发明人 SAKAI KUNIHITO;YANO HIDEYOSHI
分类号 H01L21/56;B29C43/00;B29C45/00;B29C45/02;B29C45/07;B29C45/14;B29C45/46;B29C45/50 主分类号 H01L21/56
代理机构 代理人
主权项
地址