发明名称 Hermetic cerglass and cermet electronic packages
摘要 The invention relates to a process for coating sintered cermet or cerglass articles with a metal or metal alloy. The process is particularly useful to eliminate pores and cavities from the surface of the article. During hermeticity testing, these pores and cavities trap tracer gas and result in an erroneous leak rate measurement. In one embodiment, the coated surfaces are subsequently coated with a second metal layer by immersion plating followed by electrolytic deposition. The process is particularly suited to the manufacture of cermet and cerglass components for semiconductor packages.
申请公布号 US5043535(A) 申请公布日期 1991.08.27
申请号 US19890322593 申请日期 1989.03.10
申请人 OLIN CORPORATION 发明人 LIN, LIFUN
分类号 H01L23/057;H01L23/08;H01L23/10 主分类号 H01L23/057
代理机构 代理人
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