| 摘要 |
PURPOSE:To make it possible to eliminate the need for wire bonding, to manufacture easily, and to achieve the improvement in the degree of integration by boring a through hole which runs from one side of a substrate to the other side, and extending a conductor layer which is connected with a light emitting section at one end by way of the through hole from one side of the substrate to the other side so that it constitutes an electrode. CONSTITUTION:A through hole 19, which runs through semiconductor substrates 10 and 11 from their front side to their back side, is installed. A P electrode 22, which is connected with a light emitting section at one end, is extended from the front side to the rear side by way of the through hole 19 so that it is laid out on the same plane with an N electrode 23. |
