| 摘要 |
Novel thermostable imido copolymers, well adapted for the production of prepregs useful in the fabrication of multilayer circuits, are prepared by copolymerizing (a) at least one N,N'-bis-maleimide with (b) at least one sterically hindered diprimary diamine, (c) optionally, at least one ethylenically unsaturated non-halogenated comonomer other than a bis-imide (a), (d) optionally, a free radical polymerization initiator, (e) at least one comonomer including a chlorinated or brominated epoxy resin, an N,N'-alkylene-bis-tetrahalogenophthalimide, a compound containing two phenyl radicals directly joined va a single valence bond, a divalent radical or a bridging atom, wherein such compound each phenyl radical is substituted by a (meth)allyloxy radical and by at least two chlorine or bromine atoms, and/or a non-halogenated epoxy resin, and (f) at least one alkenylphenol.
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