Process for producing semiconductor device substrate using polishing guard,申请号US19900565973-传众专利搜索

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发明名称	Process for producing semiconductor device substrate using polishing guard
摘要
申请公布号	US5032544(A)	申请公布日期	1991.07.16
申请号	US19900565973	申请日期	1990.08.13
申请人	SHIN-ETSU HANDOTAI CO., LTD.	发明人	ITO, TATSUO;NAKAZATO, YASUAKI
分类号	H01L21/304;H01L21/02;H01L21/20;H01L21/306;H01L21/762;H01L27/12	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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