Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
摘要
The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.
申请公布号
US5031821(A)
申请公布日期
1991.07.16
申请号
US19890395088
申请日期
1989.08.16
申请人
HITACHI, LTD.;HITACHI MICROCOMPUTER ENGINEERING LTD.;HITACHI TOKYO ELECTRONICS CO., LTD.