发明名称 ELECTROLESS PLATING METHOD USING NON-REDUCING AGENT
摘要 A conductive metal pattern can be formed in a polymeric layer that has a reactive polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking. The polymeric layer is patternwise exposed to provide non-exposed regions and exposed regions comprising a polymer comprising pendant sulfonic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. This pattern can be contacted with a non-reducing reagent that reacts with the electroless seed metal ions to form an electroless seed metal compound that has a pKsp of less than 40, and which is electrolessly plated with a conductive metal.
申请公布号 US2015140496(A1) 申请公布日期 2015.05.21
申请号 US201314085030 申请日期 2013.11.20
申请人 Irving Mark Edward 发明人 Irving Mark Edward
分类号 G03F7/16;G03F7/11;G03F7/20 主分类号 G03F7/16
代理机构 代理人
主权项 1. A method for forming a pattern in a polymeric layer, the method comprising: providing a polymeric layer comprising a reactive composition that comprises a reactive polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure of the reactive polymer to radiation having a λmax of at least 150 nm and up to and including 450 nm, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking in the reactive polymer, patternwise exposing the polymeric layer to radiation having a λmax of at least 150 nm and up to and including 450 nm, to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising pendant sulfonic acid groups, contacting the exposed regions of the polymeric layer with electroless seed metal ions to form a pattern of electroless seed metal ions in the exposed regions of the polymeric layer, optionally contacting the pattern of electroless seed metal ions in the exposed regions of the polymeric layer with a non-reducing reagent that reacts with the electroless seed metal ions to form an electroless seed metal compound that has a pKsp of less than 40, and electrolessly plating the bound metal electroless seed metal compound in the exposed regions of the polymeric layer with a metal that is the same as or different from the metal that is within the bound electroless seed metal compound.
地址 Rochester NY US