发明名称 |
Area-selective metallization process. |
摘要 |
<p>Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors. <IMAGE></p> |
申请公布号 |
EP0436282(A2) |
申请公布日期 |
1991.07.10 |
申请号 |
EP19900311953 |
申请日期 |
1990.11.01 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
COLE, HERBERT STANLEY, JR.;ROSE, JAMES WILSON |
分类号 |
C23C14/04;C23C14/58;C25D5/02;H01L21/48;H01L23/538;H05K3/10;H05K3/38 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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