| 摘要 |
<p>PURPOSE:To obtain an IC module of high quality excellent in productivity and an IC card using the same by providing a recessed part receiving the excessive part of the resin sealing a semiconductor element to the frame body surrounding the semiconductor element. CONSTITUTION:A frame body 2 composed of a synthetic resin molded body same to a printed wiring substrate 1 in longitudinal and lateral dimensions and having height of 0.7mm is arranged on the printed wiring board 1 to be fixed thereto by an adhesive, and an opening 4 having a size capable of sufficiently inserting a semiconductor element 3 is formed to the center of the bottom surface of the frame body 2. When the resin injected in the opening 4 is pressed by a press member 12, a part of the resin flows to run against a restraint guide wall 5 and the diffusion of the resin is suppressed by the restraint guide wall 5 by further pressing the resin to perfectly fill the gap between the semiconductor element 3 and the restraint guide wall 5 with the resin while only the excessive resin can be allowed to flow in an excessive resin receiving part (groove) 8 through connection passages 6 by the guide of the restraint guide wall 5. As a result, an IC module enhanced in operative reliability and an IC card using the same can be prepared with good mass productivity.</p> |
