| 摘要 |
<p>PURPOSE:To prevent a bonding wire from being bent downward to be shortcircuited to a semiconductor chip at the sealing of the semiconductor chip with resin by a method wherein a lead provided adjacent to the die pad of the semiconductor chip is inclined downward so as to make its inner end lower than its outer end in level, and the end of the lead connected to the bonding wire is positioned slightly lower than the die pad. CONSTITUTION:A semiconductor chip 1 is mounted on a die pad 2, and the semiconductor chip 1 is connected to the end 5 of a lead 3 with a bonding wire 4. The lead 3 is pinched between molding dies, and the cavity in the molding dies is filled with a sealing resin 8 to form a package. At this point, as the lead 3 is inclined downward making its inner end lower than its outer end in level, when the lead 3 is vertically pinched between the molding dies, an inner lead 7 of the lead 3 is forcibly deformed upward to correct the inclination of the lead 3, and a level difference t between the lead 3 and the die pad 2 is removed. By this setup, the loop of the bonding wire 3 is deformed upward to elongate a distance of l between the semiconductor chip 3 and the loop concerned. Therefore, the bonding wire 4 can be prevented from being shortcircuited to the semiconductor chip.</p> |
