PACKAGING PROCESS OF ELECTRONIC PART,申请号JP19890282425-传众专利搜索

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发明名称	PACKAGING PROCESS OF ELECTRONIC PART
摘要
申请公布号	JPH03142903(A)	申请公布日期	1991.06.18
申请号	JP19890282425	申请日期	1989.10.30
申请人	NEC KANSAI LTD	发明人	ARAI SHINJI
分类号	H01C17/02;H01G4/224	主分类号	H01C17/02
代理机构		代理人
主权项
地址

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