| 摘要 |
<p>PURPOSE:To avoid the occurrence of the pull down or through hole caused during the bonding process of a heat sink and a package through the intermediary of a resin for increasing the bonding strength and the radiation effect by a simple constitution of providing a heat sink with multiple grooves or through holes. CONSTITUTION:Multiple grooves are provided on the central parts of respective sides of the bonding surface of a heat sink 11. When bonded onto a package 13, the heat sink having partial grooves 19 is not sealed at all to restrain the pull down due to the grooves filling the role of vent holes even if a resin 18 is cured while the pressure between a metallic cap 12 and the heat sink 11 is boosted. Thus, even if the heat sink 11 and the package 13 are bonded to each other by the resin 18, the bonding strength and the radiation effect of the heat sink 11 will not deteriorate at all.</p> |
