发明名称 PHOTOSENSITIVE RESIN
摘要 PURPOSE:To obtain the positive type pattern forming material having a high resolution by forming the photosensitive resin of a maleic anhydride part of a copolymer of a compd. contg. alicyclic aliphat. hydrocarbon skeleton and maleic anhydride and denaturing the resin with alcohol contg. the cyclic diazo photosensitive group expressed by specific formula and amine. CONSTITUTION:The maleic anhydride part of th copolymer of the compd. contg. the alicyclic aliphat. hydrocarbon skeleton and th maleic anhydride is denatured with the alcohol contg. the cyclic diazo photosensitive group expressed by the formula I and the amine expressed by formula II. In the formula I, II, n is 1 to 10 integer; R is 1 to 6C alkyl group. The photosensitive resin formed in such a manner is soluble in an org. solvent and is subjected to practicable use in the form of a resist solvent at the time of using the resin for formation of ICs. The resin is dissolved in a solvent at 1 to 50wt.% ratio and the soln. is applied on a substrate consisting of Si, Al, etc.; thereafter, the solvent is evaporated and the uniform and smooth coated film is obtd. Acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, etc., are used as the solvent.
申请公布号 JPH03134668(A) 申请公布日期 1991.06.07
申请号 JP19890271515 申请日期 1989.10.20
申请人 TOSOH CORP 发明人 SEKIMOTO KENICHI;KIYOTA TORU
分类号 G03F7/023;C08G61/00;C08G61/04;G03F7/039;H01L21/027 主分类号 G03F7/023
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