发明名称 ANISOTROPIC CONDUCTIVE BONDING AGENT CONNECTION STRUCTURE AND ITS CONNECTION METHOD
摘要 <p>PURPOSE:To fill an anisotropic conductive bonding agent to section without a connecting terminal satisfactorily and hence improve adhesive strength by increasing the film thickness of a part located outside the array direction of connection terminals for an anisotropic conductive bonding agent which connects a plurality of connection terminals arrayed in one direction. CONSTITUTION:An anisotropic conductive bonding agent 13 is transferred to a board 11 where conductive patter-based connection terminals 12 are arrayed. The transfer of the bonding agent 13 allows pad print to form the increased film thickness of the end 13a of the bonding agent 13. By this, the board 11 and a board 15 are hot-pressed and bonded with the bonding agent 13 sandwiched between. The outer parts of terminals 12 and 16 are filled with the bonding agent 13, which connects both the terminals 12 and 16 electrically while the board 11 is connected with the board 15 physically. It is therefore, possible to obtain high bond strength and improve durability as well.</p>
申请公布号 JPH03132095(A) 申请公布日期 1991.06.05
申请号 JP19890269217 申请日期 1989.10.18
申请人 TOSHIBA CORP 发明人 MAKINO MITSUO
分类号 B42D15/10;H05K1/14;H05K3/32;H05K3/36 主分类号 B42D15/10
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