| 摘要 |
PURPOSE:To improve the workability of a bending process by a method wherein, after one end of a wire is bonded to a pad, the other end is held apart from a printed board and pressed against a bump and bent with the bump as a fulcrum. CONSTITUTION:When it is necessary to bond a wire 5 to a printed board 1, one end of the wire 5 is bonded to a drawing-out pad 6 (starting end) which is drawn out of a pad formed on the predetermined position of the board 1. If it is necessary to bend the wire 5 in accordance with the position of a component 4, the other end of the wire 5 is held apart from the printed board 1 with tweezers and the wire 5 is pressed against a bump 3 closest to the bending position and wound. More concretely, the wire 5 is wound around a part (h) where the side wall of the bump 3 is vertical. The wire 5 is moved to the direction of wire bending while it is held with the tweezers and then bent. After the wire 5 is bent, it is moved to an original forming position and the other end of the wire 5 is bonded to another drawing-out pad 6' (finishing end). Finally, the flatness of the bumps 3 is processed to complete the wiring. |
