| 摘要 |
A method of clamping an electrical power device to a heat sink comprising the steps of: positioning a power device (42) proximate to said heat sink (44) whereby one face of said power device is to be in contact with said heat sink; positioning shrinkable securing means such as a sleeve (48) made from shrinkable thermoplastics material round the power device and heat sink arrangement; and shrinking said shrinkable securing means onto said power device and heat sink arrangement whereby said power device is clamped to said heat sink. A semiconductor assembly produced by such a method is disclosed. <IMAGE> |
