发明名称 |
Three-dimensional printed circuit board |
摘要 |
A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The flexible connecting sections are fashioned as thin regions having a thickness less than the thickness of the rigid board sections. When a semi-crystalline or liquid-crystalline thermoplastic molding material is used, the connecting sections are formed as flexible film hinges, whereas an amorphous thermoplastic molding material results in the connecting sections being bendable only under the influence of heat.
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申请公布号 |
US5008496(A) |
申请公布日期 |
1991.04.16 |
申请号 |
US19890383648 |
申请日期 |
1989.07.24 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SCHMIDT, HANS-FR.;RAUCHMAUL, SIEGFRIED;BEDNARZ, JUERGEN |
分类号 |
C08L79/08;C08L81/02;H05K1/00;H05K1/02;H05K1/18;H05K3/00 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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