| 摘要 |
PURPOSE:To securely inspect a solder joint part by outgoing an ultrasonic wave from an ultrasonic wave transmitter which is connected to a semiconductor device and receiving it by an ultrasonic wave receiver connected to a package substrate. CONSTITUTION:A pulse wave oscillation device 1 oscillates pulse waves converted by an ultrasonic wave oscillation device 2 into the ultrasonic wave. The converted ultrasonic wave is transmitted to the semiconductor device 3 connected to the ultrasonic wave oscillation device 2, and the solder joint part 4 and package substrate 5 and converted by the ultrasonic wave reception device 6 connected to the package substrate 5 into an electric signal, which is amplified by a receiver 7 and observed on an oscilloscope 8. Here, when the semiconductor device 3 and package substrate 5 are connected, the ultrasonic wave is transmitted to the package substrate 5, but when the semiconductor device 3 and package substrate 5 are not connected, the ultrasonic wave is reflected and not transmitted to the package substrate 5, so the state of the solder joint part 4 can securely be inspected. |
