| 摘要 |
<p>PURPOSE:To extremely enhance surface flatness and to easily form multilayer interconnections by providing a groovelike conductor forming part on an insulating layer of synthetic resin such as polyimide, etc., and providing a conductor on a conductor close contact layer provided as a lower layer in the bottom of the forming part. CONSTITUTION:A conductor close contact layer 12 is formed on a base 10 of polyimide according to a predetermined pattern. Then, an insulating layer 14 of polyimide is so provided in a reverse pattern to the layer 12 as to form a groove on the layer 12. A conductor part 16 is stacked on the layer 12 by plating. Then, an insulating layer 14a made of polyimide for covering is provided on the upper layer of the layer 14. Since the base provided with the layer 14a for covering is formed in advance in a flat surface state, the level difference of the surface of the insulating layer can be extremely reduced.</p> |
