| 摘要 |
<p>PURPOSE:To mount a film carrier type semiconductor device on a printed board by a solder reflow method by temporarily tacking leads which are provided on a suspender supporting frame of a suspender supporting frame part to a printed board, and correcting the warping of a suspender. CONSTITUTION:A semiconductor chip part is separated from a film carrier tape, and tacking leads 8 and outer leads 6 are cut. Thereafter, both leads are molded. Solder paste is applied on bonding-pad parts 3 and tacking pads 7 beforehand on a printed board. A semiconductor chip 1 whose cutting and lead molding are finished is mounted on the printed board after the position alignment with the bonding pads 3 and the outer leads 6. The tacking leads 8 are bonded to the tacking leads pads 7 by solder 4. The warping of a suspender 2 is corrected by bonding the tacking leads 8 to a printed board beforehand. The outer leads 6 which are molded at the lower part than the tacking leads 8 are securely bonded to the bonding pads 3 by a solder reflow method.</p> |
