| 摘要 |
PURPOSE:To avoid the damage on an IC chip surface and the breakage of chip angles during pick-up process by a method wherein a soft cushion member having a through hole in large diameter capable of passing Si pieces bonded onto IC chip surface is mounted on a suction port sucking IC chips by negative pressure. CONSTITUTION:The title semiconductor manufacturing device with a suction port 5b sucking IC chips cut out of a wafer by negative pressure (a) is provided with a soft cushion member 6 having a through hole capable of passing Si pieces bonded onto the IC chip surfaces on the said suction port 5b so as to suck the IC chips through the intermediary of the cushion member 6. For example, a holder 5c is formed on the peripheral part of the said suction port 5b provided on one end of the communication path 5a of a collet 4 with a cylinder 5 forming the communication path 5a for negative pressure so as to fix the cushion member 6 to the holder 5c. Finally, as for the cushion member 6, sponge or soft urethane foam, etc., are applicable. |
