| 摘要 |
<p>PURPOSE:To connect a semiconductor element mounted on a circuit board with an upper surface electrode, and increase the heat dissipating effect of the semiconductor element, by boring an insertion hole and window holes in a resin film, and forming a lead base part covering the insertion hole and outer leads stretching from the lead base part. CONSTITUTION:In a tape carrier 1, the follow are bored; a square insertion hole 1a-1 for inserting the die 10a of a semiconductor element 10 into the resin film 1a on a tape composed of polyimide resin and the like, and window holes 1a-2 at the positions corresponding with the power supply conductor land 2b of a circuit board 2. On the single surface of the resin film 1a, a connection conductor 1b composed of the following is arranged; a lead base part 1b-1 covering the insertion hole 1a-1 and joining to a power supply electrode 10C formed on the whole part of the die 10a upper surface of a semi-conductor element 10, and outer leads 1b-2 stretching from the lead base part 1b-1 to the central parts of the window holes 1a-2 on the four sides and joining to the power supply conductor land 2a. The width of the outer lead 1b-2 is suitably wide in order to improve thermal conduction.</p> |
