发明名称 CIRCUIT BOARD
摘要 PURPOSE:To obtain a circuit board, which has a thermal expansion identical with that of gallium-arsenic and is formed with a metal wiring consisting of copper or the like, by a method wherein the circuit board consists of a ceramic plate containing alumina, silicon dioxide and zirconia, which are respectively set at a specified amount. CONSTITUTION:A circuit board consists of a ceramic plate containing at least 4 to 17wt.% alumina, 20 to 55wt.% silicon dioxide and 10 to 50wt.% zirconia and has at least one side of a wiring, which is provided extendedly on this ceramic plate and consists of a metal layer, and a wiring, which is formed penetrating the ceramic plate and consists of a metal layer. In order to manufacture the circuit board, at least one side of a wiring, which is provided extendedly on the molded material of a mixture of aluminosilicate glass and glass silicate and consists of a metal layer, and a wiring, which is formed penetrating this molded material and consists of a metal layer, is formed on this molded material, a green sheet consisting of the molded material of a mixture is formed and the green sheet is fired at a temperature between the softening point of the aluminosilicate glass and the softening point of the glass silicate.
申请公布号 JPH0322552(A) 申请公布日期 1991.01.30
申请号 JP19890155876 申请日期 1989.06.20
申请人 FUJITSU LTD 发明人 AOKI SHIGENORI;IMANAKA YOSHIHIKO;YOKOUCHI KISHIO
分类号 C04B41/88;C04B35/18;C04B35/48;H01L23/15;H05K1/03 主分类号 C04B41/88
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