METHOD FOR ENCAPSULATING AN ELECTRONIC DEVICE AND APPARATUS FOR CARRYING OUT THIS METHOD

摘要

To form a compressible interlayer (7) between chip (1) and envelope (21), it is proposed to dispense a UV-curable gel using a multiple needle (8-13). The multiple needle is passed across the chip surface with varying directions of movement and possibly, also with varying speeds. After application, the layer is pre-cured, in particular on a strip (20) which follows the multiple needle at a specified distance. ……