PHOTO-SEMICONDUCTOR MODULE

摘要

A photo-semiconductor module is disclosed wherein a reliable airtight condition can be obtained and an operability in assembly can be improved. The photo-semiconductor module comprises a substrate (31) carried in a casing (30), a photo-semiconductor chip (33) mounted on the substrate (31), and a support member (35) carried on the substrate (31) and having an inclined face which is inclined by an angle of 45 degrees with respect to a surface of the substrate. A semi-spherical lens (36) is securely mounted on the inclined face of the support member (35), and an opening (39) formed in a side wall of the casing (30) is sealed airtight by a glass member (40) while an upper portion of the casing (30) is sealed airtight by a lid (44). When an optical fiber (41) is mounted onto the casing (30) such that an end face thereof may be located in the opening (39) in the side wall of teh casing (30), the optical fiber (41) and the photo-semiconductor chip (33) are optically coupled to each other by way of the semi-spherical lens (36).