发明名称 HYBRID INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To obtain a safe device capable of stably detecting a large current independently of temperature change by providing a conducting path, the main circuit of a power inverter, and a protecting circuit on an integrated circuit substrate composed of metal, and fusing a bonding wire of a power semiconductor element when an excessive current which can not be protected by the protecting circuit generates. CONSTITUTION:The following are provided; an integrated circuit substrate 7 composed of metal, a conducting path 9 of desired shape formed on the substrate 7, the main circuit 8a of a power inverter composed of a plurality of power semiconductor elements 8 which are connected with the conducting path 9 and controls a current supplied from a power supply to a load, and a protecting circuit 8b formed in order to prevent the destruction of power semiconductor elements caused by an excessive current or voltage by using a part of the conducting path 9 stretched in the vicinity of the power semiconductor elements 8 constituting the above main circuit 8a. When the excessive current or voltage which can not be protected by the protecting circuit 8b generates, a bonding wire 8c connecting the power semiconductor element 8 and the adjacent conducting path 9 is fused, thereby cutting off the current supplied from a power source.</p>
申请公布号 JPH033356(A) 申请公布日期 1991.01.09
申请号 JP19890138614 申请日期 1989.05.31
申请人 SANYO ELECTRIC CO LTD 发明人 OKAWA KATSUMI;SHIMIZU HISASHI
分类号 H05K1/18;H01L23/58;H01L23/62;H01L25/04;H01L25/07;H01L25/18;H05K1/02;H05K1/16 主分类号 H05K1/18
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