INTEGRIERTE SCHALTUNGSANORDNUNG AUF HALBLEITERSCHEIBENSKALA.

摘要

Disclosed is a substrate for an array of integrated circuit dice 10 min disposed in a regular array on the monolithic wafer substrate 1. Also disposed on the wafer substrate 1 is a network 11 min interconnecting various circuits 10 min , with other integrated circuits, disposed in the array formed on the wafer for data transfer therebetween. Terminals 12 min exist in the network 11 min for connection of the connections of the network with the various integrated circuits 10 min . The networks are connected to a contact pad by one or more connection pads 13 min , for power and for data entry, and there is provided an auxiliary lead and contact pad for each network for testing each network for operability, also disclosed in the testing method.