METHOD FOR PLATING WAFER,申请号JP19890084709-传众专利搜索

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发明名称	METHOD FOR PLATING WAFER
摘要
申请公布号	JPH02263994(A)	申请公布日期	1990.10.26
申请号	JP19890084709	申请日期	1989.04.05
申请人	CASIO COMPUT CO LTD	发明人	YAMAMOTO MICHIHIKO
分类号	C25D5/08;C25D5/34;H01L21/321;H01L21/60;(IPC1-7):C25D5/34	主分类号	C25D5/08
代理机构		代理人
主权项
地址

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