| 摘要 |
PURPOSE:To eliminate a long wire and realize the optimum wire connection between a semiconductor chip and inner leads by arbitrarily setting the angle of a contact bonding ball part. CONSTITUTION:A plurality of bonding pads 5a (contact bonding ball) arranged on a semiconductor chip 5 and each inner lead 4 corresponding with the bonding pad are connected with a wire 6. A bonding pad 5a (contact bonding ball) part is constituted of a wire ball contact bonding part 5d, a part 5c formed by an inside chamfer and a neck part 5b. An angle (theta) in the range of 10 deg.-90 deg. can be arbitrarily set between the part 5c formed by the inside chamfer and the neck part 5b. Thereby a problem that the wire 6 becomes long when it is connected with the tip part of the inner lead 4 can be avoided. |
