| 摘要 |
PURPOSE: To enable high density connection and low power consumption by providing a heat sink with a microchannel and a heat conductive cushion material between a surface of the heat sink and the backside of an integrated circuit chip. CONSTITUTION: An element, having three unique mutual relations between thermal and electric characteristics, is used. This first element is a multilayer wiring substrate 16 provided on the opposing surface of a supporting substrate 15 for the purpose of connecting the front surface of an integrated circuit chip 20 which is fixed by a conductor 17, extending from one surface to its opposing surface, or by the supporting substrate 15 having a connector. The second element is a heat sink 26 having a microchannel 27 formed on one surface, and the third element is a heat conducting cusion material 28, with which one surface of the heat sink 26 is connected to the exposed backside 42 of the integrated circuit chip 20. As a result, high density mutual connection and low power consumption can be obtained for the integrated circuit chip 2. |
