| 摘要 |
<p>PURPOSE:To conduct the machining of a circuit board in an easy manner with an enhanced reliability and to obtain a low-cost and high-reliable semiconductor device by a method wherein an IC chip is mounted on a spot-facing part formed in a two-layer circuit board, and the substrate of said IC chip is connected to the cross section of an intermediate pattern exposed on the side wall of the counterbore part by loading a conductive adhesive in the counterbore part. CONSTITUTION:A counterbore part 8 is formed to be deeper than an intermediate pattern 3b from the top surface side of a laminated circuit board 2. In this condition, a cross section 3b' of the intermediate pattern 3b is exposed in a loop form on the side wall of the counterbore part 8. In addition, an IC chip 1 is die bonded on the bottom of the counterbore part 8 through a conductive adhesive 9. At this time, the conductive adhesive 9 is loaded in the amount larger than a prior art so as to reach the cross section 3b' of the intermediate pattern 3b exposed on the side wall of the counterbore part 8. As a result, a substrate 1a of the IC chip 1 is connected to a power source pattern 3c on the top surface through the adhesive 9, the cross section 3b', the intermediate pattern 3b, and a through hole 6.</p> |
