Device for bonding two parts of different expansion behaviour which can be joined to each other

摘要

With the device (2), two parts (5 and 8, 10) of different expansion behaviour which can be joined to each other are to be bonded. For releasing this bond, in particular a heating apparatus (12) is provided. At an assembly temperature (Tm), above an operating temperature (Tb), a small assembly gap (19) is formed between the parts to be bonded. According to the invention, an insert (8) is to be introduced in a recess (7) of an outer bonding part (5) of relatively great coefficient of expansion ( alpha 1). This insert can be cooled to the operating temperature (Tb) and contains an inner part (10) of a material of a comparatively much lower coefficient of expansion ( alpha 2) and also an intermediate element (9) of good thermal conductivity, bounding the assembly on one side. This intermediate element is deformed during the cooling phase from the assembly temperature (Tm) to the operating temperature (Tb) and thus forms a thermal contact with respect to the outer bonding part (5). This bonding part is provided with the heating apparatus (12). <IMAGE>