CONNECTION OF SEMICONDUCTOR ELEMENT; THIN-FILM SUPERELASTIC METAL PASTE USED TO OBTAIN ELECTRICAL CONNECTION THEREOF

摘要

PURPOSE:To enhance reliability of an electrical connection and to realize a low cost by a method wherein the electrical connection is executed via a superelastic body material and the superelastic body material is formed of a thick-film superelastic metal paste. CONSTITUTION:A superelastic metal bump 23 is formed by using a thick-film superelastic metal paste; a semiconductor element 21 is connected to a substrate 22 via this superelastic metal. Accordingly, even when a strain is caused by generated heat of the semiconductor element 21 and by a change in an ambient temperature, the superelastic metal is deformed within an elastic range and absorbs a stress. Thereby, reliability of an electrical connection of the semiconductor element 21 is enhanced; it is possible to form the superelastic metal bump 23 at a low cost.