发明名称 HYBRID CIRCUIT
摘要 PURPOSE: To provide a thick insulator and a substrate having a small coefficient of thermal expansion to a hybrid circuit comprising a cross bridge by a method wherein an insulative thick film, which is constituted of a specified composition, is provided on the substrate consisting of a specified material. CONSTITUTION: A plurality of metallized lines 12 are formed between terminals 14 and 14 on a basic substrate constituted of a material selected from among an Al nitride and mullite and cordierite types of glass ceramics. A cross bridge 15 consisting of an insulate thick film is provided between electrodes 20 and 20 on this substrate 10 and a circuit element 18 is provided thereon. The film is constituted of glass ceramics having the primary crystalline phase of a silica zinc ore and the secondary phase of an cordierite. This film fundamentally does not contain an Na2 O, an Li2 O and a K2 O and substantially consists of 15 to 45% of a ZnO, 3 to 15% of an MgO, 10 to 30% of an Al2 O3 and 30 to 55% of an SiO2 .
申请公布号 JPH02226787(A) 申请公布日期 1990.09.10
申请号 JP19890330930 申请日期 1989.12.20
申请人 CORNING GLASS WORKS 发明人 GEIROODO RII FURANSHISU;FURANSHISU UIRISU MAATEIN
分类号 H05K1/03;H01L23/15;H01L23/498;H05K3/46 主分类号 H05K1/03
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