| 摘要 |
PURPOSE: To provide a method for manufacturing a semiconductor device capable of reducing a cost by decreasing mounting area, and a method for manufacturing a semiconductor device capable of preventing adherence of an extra deposit on a surface of a backside electrode. CONSTITUTION: A substrate 21 having many mounts 20 is prepared. External connection electrode patterns 31 are formed on a backside of the substrate 21. Semiconductor chips 33 are mounted on the mounts 20, respectively, covered with a resin layer 35, and a surface of the layer 35 is processed to be a horizontal and flat surface. A dicing sheet 50 is adhered to the layer 35 so that the patterns 31 are laminated upward. In this state, the substrate 21 and the layer 35 are cut by dicing, and separated individual semiconductor devices are formed at the respective mounts 20. |
