发明名称 RING FOR EXPANDING
摘要 <p>PURPOSE:To prevent an expanded film with a wafer from being off a ring for expanding due to contraction force by providing a slide stop made of a material having a large friction coefficient to the film with a wafer in addition to an O-ring provided on a carrier ring. CONSTITUTION:An expanded film with a wafer is prevented from being off due to contraction force during an expanding process and after finishing the process by providing a slid stop 11 of heat-resisting rubber having a large friction coefficient to the film with a wafer on the side peripheral face of a carrier ring. 3. Thereby, on the wafer surface is prevented to realize mounting with a high yield. This slide stop is formed in the state of warty projections.</p>
申请公布号 JPH02211649(A) 申请公布日期 1990.08.22
申请号 JP19890032115 申请日期 1989.02.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAGI HIROFUMI
分类号 H01L21/67;H01L21/68 主分类号 H01L21/67
代理机构 代理人
主权项
地址