发明名称 Method and apparatus of bonding insulated and coated wire
摘要 A method of bonding an insulated and coated wire which has an insulated coating on the outside of an electrically conductive wire is disclosed which consists in connecting one end of said insulated and coated wire to the anode side of an arc power source and connecting a discharge torch to the cathode side of said arc power source with an arc discharge performed between the tip of said insulated and coated wire and the discharge torch to form a ball at said end, and said ball being positioned with respect to the bonding pad of an electrically conductive electrode and bonding being performed with a specified pressure applied to said ball.
申请公布号 US4950866(A) 申请公布日期 1990.08.21
申请号 US19880277645 申请日期 1988.11.29
申请人 HITACHI, LTD. 发明人 KOJIMA, TOOSAKU;MIMATA, TSUTOMU;OKIKAWA, SUSUMU;OKAMOTO, MICHIO;KAWANA, TAKESHI;URAYAMA, SATOSHI
分类号 B23K20/00;H01L21/607;H01L23/49 主分类号 B23K20/00
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