| 摘要 |
PURPOSE:To improve a manufacture yield and reliability without any generating of short-circuit and leakage inspite of extrusion of an adhesive by using an insulating adhesive for fixing an insulating wiring substrate and a substrate island. CONSTITUTION:An insulating wiring substrate 2 is stuck on a substrate island 1 with an insulating adhesive 4, further two semiconductor chips 3 and 3 are stuck with a conductive adhesive 9. Here, the insulating adhesive 4 is used for fixing the insulating wiring substrate 2 and the substrate island 1. Accordingly, even when the adhesive 4 is extruded or oozes out to contact with a wiring pattern 5 or the semiconductor chips 3, 3' and 3'', a short-circuit or the leakage between the semiconductor chips are excluded from generation on account of being insulating. Thereby, the danger of generated short-circuit and leakage is completely eliminated while improving an yield and reliability. |
